PROBE CARD FOR TESTING A SEMICONDUCTOR DEVICE

摘要

PURPOSE: A probe card for testing semiconductor devices is provided to minimize exchange of a probe card used in a process of testing semiconductor devices and to easily verify the characteristic of a test tip to stably test the semiconductor devices. CONSTITUTION: A probe card for testing semiconductor devices includes a main card(20) electrically coupled to a test system and having main electronic circuits necessary for test. A subcard(40) has a test tip contacting terminals of the semiconductor devices and detachably coupled to one side of the main card. A main center hole(24) is formed to be penetrated in a given side on a circuit plate(22). At least pair of main mating grooves are formed around the main center hole. A plurality of pin holes(28) are penetrated to have the same distance from the center of the main center hole and are coupled to fog pins. A plurality of thin plates are located at one side of the circuit plate and electrically connected to the pin hole between an edge of the main center hole and the pin hole. The subcard is formed to be penetrated in a given size on a circuit plate. When the subcard is coupled to the main card, a subcenter hole(44) is located on the same line to the main center hole. At least pair of sub mating holes(50) are formed around the subcenter hole. When the subcard is coupled to the main card, the sub mating holes are located on the same line to the main mating holes. A plurality of thin plates is formed to have the same distance from the center of the sub center hole. When the subcard is coupled to the main card, one end of the fog pin is electrically connected to the plurality of thin plates.