MANUFACTURING METHOD AND MOLD STRUCTURE FOR F-BGA SEMICONDUCTOR PACKAGES

摘要

PURPOSE: A method for manufacturing an F-BGA(flexible ball grid array) package and a mold die structure are provided to prevent a crack of a semiconductor chip by entirely exhausting remained air using a float insert. CONSTITUTION: The F-BGA fabrication method comprises the steps of setting a carrier frame (1) wire-bonded a semiconductor chip (5) into a float insert (M1) having an air exhaust unit of a mold die (M); entirely exhausting airs remained between the float insert (M1) of the mold die (M) and a flexible circuit substrate (3) using the air exhaust unit, thereby tightly mounting the flexible circuit substrate (3) on the float insert (M1); and inserting a mold compound into the mold die (M).