| 摘要 |
An integrated circuit includes conductive elements (415.i, 417.j) and a radiation sensitive material (511) interposed between the conductive elements and dosed to different conductivities in different portions (e.g. 447) thereof. Another aspect is a process of integrated circuit fabrication including steps (163, 615) of depositing a radiation sensitive material as a layer and variably dosing it with radiation to establish areas of higher and lower resistivity in the layer. A printed wiring board (241) includes radiation sensitive material (251) and the board further has a conductor layer (245, 247, 249) affixed to the base. A transistor (1401) has a radiation sensitive material (1413) dosed to have two conductive regions (1431, 1433) separated by a gap (1435) of a lower conductivity in the radiation sensitive material, and a conductive substance (1415) deposited over the gap. These elements are useful in smart power devices, digital computers, controllers and electronic applications generally. Other devices, systems and processes are disclosed. <IMAGE> |
