发明名称 |
METHOD FOR MULTI-LAYER METAL LINE |
摘要 |
PURPOSE: A method for forming a multi-layer metal line is provided to flatten easily an interlayer dielectric by forming an insulating layer spacer at a sidewall of a lower metal line. CONSTITUTION: A metal layer is formed on an upper portion of a lower insulating layer(1). A thin insulating layer is deposited on the metal layer. The thin insulating layer and the metal layer are etched partially and a groove is formed thereon by using a metal line mask. An insulating layer spacer is formed at a sidewall of the groove. The remaining metal layer of a bottom of the groove is etched by using the thin insulating layer and the insulating layer spacer as a mask. A convex metal line is formed by etching the remaining metal layer of the bottom of the groove. The first insulating layer(6) is formed on the whole surface. The second insulating layer(7) is formed on the first insulating layer(6).
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申请公布号 |
KR100268797(B1) |
申请公布日期 |
2000.11.01 |
申请号 |
KR19930029271 |
申请日期 |
1993.12.23 |
申请人 |
HYUNDAI ELECTRONICS IND. CO., LTD |
发明人 |
CHOI, YANG GYU |
分类号 |
H01L21/3205;(IPC1-7):H01L21/320 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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