Ceiling or underfloor heating or cooling apparatus with heat conducting grooved panels

摘要

A ceiling or underfloor heating/cooling apparatus consists of heat conducting panels (4) with grooves (10) which house heating or cooling pipes (8). The pipes (8) are retained in the grooves (10) by the location of the ceiling or floor against the panels (4). The primary heat transfer process is by conduction through the pipe to the panel (4), and then to the ceiling or floor boards. The panel (4) may be manufactured from aluminium coated with an insulating and fire retardant backing (6). The panels have flanges (12) to locate within U-shaped metal joists (14), which are attached to one another through a metal primary support cross bar (16). A thermal break element (18) of insulating material is located at each end of the panel.