| 摘要 |
PURPOSE: A microwave device mounting package is provided to simplify the circuit construction and reduce the cost by allowing parasitic components to be reduced itself within the package without processing by an external circuit. CONSTITUTION: A microwave device mounting package includes a microwave device chip assembled on a back metal(1) of a microwave device mounting package. A bonding pad is formed on the chip. A double bonding wire(7") is electrically connected between internal circuits and external circuits of the chip. The double bonding wire(7") molds a dielectric(10) having a given dielectric constant at a given space exposed to air. The dielectric(10) is connected between the bonding pad on the chip assembled on the back metal(1) and a lead strip on alumina side. |
