发明名称 Processing apparatus for manufacturing semiconductors
摘要 A processing apparatus comprises a support for supporting a body to be processed within a processing chamber. The support is equipped with a lift for lifting said body and lowering the body. The lift includes a plurality of rods disposed in a plurality of cylinders formed through the support, respectively. Each of the plurality of rods has a piston for movement in one of the plurality of cylinders to produce reduced pressure in a space within the cylinder between the piston and the body resting on the support. An actuator is drivingly coupled with the plurality of rods to lower the rods against suction created due to reduced pressure in the spaces.
申请公布号 US6139682(A) 申请公布日期 2000.10.31
申请号 US19990288496 申请日期 1999.04.08
申请人 NEC CORPORATION 发明人 IWATA, SEIYA
分类号 C23C16/44;C23C16/458;H01L21/205;H01L21/683;H01L21/687;(IPC1-7):C23F1/02;C23C16/00;B05C13/00;B25B11/00;B25B13/00 主分类号 C23C16/44
代理机构 代理人
主权项
地址
您可能感兴趣的专利