发明名称 |
Micro-cleavage method for specimen preparation |
摘要 |
A micro-cleavage method for preparing a semiconductor specimen for examination by an optical or electron microscopic is disclosed. The method can be carried out by hand and thus no expensive equipment such as a polishing machine is necessary. In the method, at least two bird's beak marks are cut in a top surface of a silicon wafer that contains a target, i.e., a defect or a circuit to be examined. The bird's beak marks are formed by a wide scribe line and a narrow scribe line overlapped together. The wide scribe line of the bird's beak mark is used for visual alignment with the edge of a rigid substrate, while the fine scribe line is utilized for initiating a crack when a bending stress is applied on the bird's beak mark. The bird's beak mark can be made by using a laser cutter after a wafer slice which contains the target area is first cleaved by mechanical means such as a diamond knife. A first bird's beak mark is formed at the cleaved edge of the slice and a second bird's beak mark is formed with its fine scribe line oriented toward the target. When a bending stress is applied on the top surface of the silicon slice, stress concentrates on the bird's beak marks and creates a fine crack to propagate along a crystallographic plane in the wafer toward the target thus exposing the target in a fractured surface.
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申请公布号 |
US6140603(A) |
申请公布日期 |
2000.10.31 |
申请号 |
US19990283000 |
申请日期 |
1999.03.31 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD |
发明人 |
HWANG, RUEY-LIAN;HUANG, YUNG-SHENG |
分类号 |
B23K26/40;H01L21/304;(IPC1-7):B23K26/00 |
主分类号 |
B23K26/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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