| 摘要 |
<p>PROBLEM TO BE SOLVED: To effectively remove the particles liberated from between adjacent semiconductor wafers in the case when the wafers washed by wet type in a state in which many sheets of the semiconductor wafers are arranged longitudinally. SOLUTION: In the washing device in which the washing is executed by mounting many sheets of the semiconductor wafers on a washing tool 60 in a parallel state of the figure closely facing each other while keeping the wafers in longitudinal set position along a vertical direction in the case when the wafers are washed by the wet type, at the time of arranging many sheets of the semiconductor wafers in the parallel state, many sheets of the semiconductor wafers are arranged at the washing tool 60 in a state in which one side surface of the first group S1 previously mounted on the washing tool 60 and one side surface of the second group S2 later mounted on the washing tool 60 are kept in the same surface side while putting both surfaces close each other.</p> |
