| 摘要 |
PROBLEM TO BE SOLVED: To lessen variations in the substrate rubbing force of a solder separat ing means and to improve the separation efficiency of solder by forming the substrate contact parts of the struts of a substrate carrier to a peak shape. SOLUTION: The soldered parts of a printed circuit board P come into contact with the contact parts of the frame struts 44, and the printed circuit board P float from the frame struts 44 when the printed circuit board P is fixed to the substrate carrier 40. Whereas, the contact parts of the frame struts 44 are formed to the peak shape and, therefore, the soldered parts eventually bite into the contact parts when softed by a panel heater. Then, when the printed circuit board P fixed to the frame struts 44 moves on the brush groups 31c of a cylindrical brush device rotating at a high speed, the distance between the rear surface of the printed circuit board P and the front ends of the brush groups 31c is kept constant. Consequently, the force of the brush groups 31c to rub the soldered parts is stabilized and all the brush groups 31c are capable of rubbing the soldered parts.
|
