| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an underfill-sealing epoxy resin composition which securely connects a semiconductor device such as CSP, BGA, etc., on a wiring board at a high productivity through thermosetting within a short time, or without giving any deleterious effect on various parts of the wiring board through thermosetting at a relatively low temperature, exerts an excellent heat-shock resistance (temperature cycleability) and impact resistance, allows no bleeding of pollutants from the cured product, allows easy removal of CSP or BGA from the wiring board when any failure should be found, and enables recycling of normal wiring boards and semiconductor devices. SOLUTION: A thermosetting resin composition is used as an underfill-sealing compound which seals between a semiconductor device 1 such as CSP, BGA, etc., and a wiring board 2 which is electrically connected with the semiconductor device. The resin composition essentially comprises (a) 100 pts.wt. polyfunctional epoxy resin which is liquid at an ordinary temperature and has two or more glycidyl groups in a molecule,(b) from 3 to 80 pts.wt. hardener and (c) from 1 to 100 pts.wt. modified epoxy resin.</p> |
