| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning apparatus for a mold clamping device which can remove soils of an upper and lower molds, without polluting the environment. SOLUTION: A cylindrical body 8 is inserted into between an upper mold 6 and a lower mold 5 to form a closed space S. An electrode 9 connected to a high frequency power source 10 is provided in the cylindrical body 8. The interior of the space 8 is exhausted by a vacuum pump 12 to create a vacuum, and a working gas is supplied from a gas feed unit 14. The space S is depressurized to feed a working gas, and if a high frequency current is fed to the electrode 9, a plasma is generated in the apace S, whereby the upper and lower molds 6, 5 are cleaned. |
