发明名称 MANUFACTURE OF WOODY MOLDED BOARD
摘要 PROBLEM TO BE SOLVED: To ensure a superb adhesive force and an outstanding durability with homogeneity, even when a comparatively low-priced non-emulsification-type organic isocyanate compound is used as such by applying fine particles of a specified particle diameter or smaller of the non-emulsion-type organic isocyanate compound and water separately by means of spraying. SOLUTION: Various kinds of woody materials processed in the form of chips or fibers are dried. Next, these woody materials are conveyed to a blender internally equipped with at least one unit each of a nozzle for an organic isocyanate compound and a nozzle for water. Further, the organic isocyanate compound and the water are separatedly applied by means of spraying while the materials are stirred in a blender. In this case, the organic isocyanate compound to be used as an adhesive is of a non-emulsion type. In addition, an air atomizing nozzle is used as a nozzle for the organic isocyanate compound to atomize the compound into fined particles of 100μm or below particle diameter. Finally the woody materials are formed into the shape of mats and pressed under thermal pressure.
申请公布号 JP2000301503(A) 申请公布日期 2000.10.31
申请号 JP19990113394 申请日期 1999.04.21
申请人 OKURA IND CO LTD 发明人 OTA TAKAYOSHI;KURIMOTO KENICHI;YAMAMOTO SHIGEAKI
分类号 B27N3/00;B05D1/02;B05D7/06;B05D7/24;B27N1/02;C09J5/04;C09J175/12;(IPC1-7):B27N3/00 主分类号 B27N3/00
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