发明名称 RESIN COATED ABRASIVE GRAIN, MANUFACTURE THEREOF, AND RESINBOND GRINDING TOOL
摘要 PROBLEM TO BE SOLVED: To restrain local overheat of an abrasive grain by coating the surface of abrasive grains with a resin layer in which diamond cluster is dispersedly arranged. SOLUTION: Resin coated abrasive grains 10 are provided with super abrasive grains 11 such as diamond or cBN therein, and the outer surface is formed with a thin heat resisting resin coating layer 12 (resin layer). By using the resin coated abrasive grains 10 as the abrasive grains of a resinbond grinding tool, because in addition to improve heat resistance and abrasion resistance of the abrasive grains 10 at grinding, thermal conductivity is improved to conduct heat generated in the super abrasive grains at grinding to a resin combined phase through the resin coating layer 12, thermalconductivity is improved and the super abrasive grains 11 are not locally overheated at grinding. Further, conformity of the resin coating layer 12 of the resin coated abrasive grains 10 with the resin combined phase is good to heighten holding strength, and hence falling off of the abrasive grains 10 is restrained to be able to improve the strength and the life of the grinding tool.
申请公布号 JP2000301460(A) 申请公布日期 2000.10.31
申请号 JP19990110165 申请日期 1999.04.16
申请人 MITSUBISHI MATERIALS CORP 发明人 TAKAHASHI TSUTOMU;TAKANO TOSHIYUKI
分类号 B24D3/00;B24D3/28;(IPC1-7):B24D3/00 主分类号 B24D3/00
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