发明名称 Method of manufacturing a semiconductor device comprising a ferroelectric memory element
摘要 The invention relates to a semiconductor device comprising a semiconductor body (3) with a semiconductor element (1) with an electrically conducting region (5) on which a capacitor (2) forming a memory element is present with a lower electrode (11), an oxidic ferroelectric dielectric (12), and an upper electrode (13), which lower electrode (11) makes electrical contact with the conducting region (5) and comprises a layer with a conductive metal oxide (112) and a layer (111) comprising platinum. The layer with the conductive metal oxide (112) acts as an oxygen barrier during manufacture. The invention also relates to a method of manufacturing such a semiconductor device. According to the invention, the device is characterized in that the layer comprising platinum (111) contains more than 15 atom % of a metal capable of forming a conductive metal oxide, and in that the layer (112) with the conductive metal oxide is present between the layer (111) comprising platinum and the ferroelectric dielectric (12). A good electrical contact between the lower electrode (11) and the conducting region (5) after manufacture is achieved thereby.
申请公布号 US6140173(A) 申请公布日期 2000.10.31
申请号 US19980025372 申请日期 1998.02.18
申请人 U.S. PHILIPS CORPORATION 发明人 WOLTERS, ROBERTUS A. M.;KEMPERMAN, JOHANNA H. H. M.
分类号 H01L21/8247;H01L21/28;H01L21/8242;H01L27/10;H01L27/108;H01L27/115;H01L29/43;H01L29/788;H01L29/792;(IPC1-7):H01L29/12 主分类号 H01L21/8247
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