TREATMENT METHOD OF WASTE PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide the subject treatment method capable of suppressing the amt. of solder mixed into a substrate resin component recovered by treating a printed circuit board to efficiently separate a metal component and the substrate resin component. SOLUTION: A treatment method of a waste printed circuit board is characterized by including a heating process 12 performing the dry distillation of a printed circuit board having a copper foil having solder arranged on at least a part of the surface thereof at 250 deg.C or higher, a grinding process 13 for grinding the dry distillation matter of the printed circuit board obtained in the heating process 12 and a separation process 14 separating the ground matter of the waste printed circuit board obtained in the grinding process into a substrate resin component and a metal component.