发明名称 EPOXY RESIN SEALING MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a sealing material which is excellent in storage stability, flexibility after curing, and adhesion to substrates and quickly cures by moisture at normal temperature by compounding a specific heterocyclic compound with a polyepoxy compound as a latent curing agent. SOLUTION: This sealing material comprises a heterocyclic compound having at least two heterocyclic groups represented by the formula and a polyepoxy compound. In the formula, R is a 2-10C linear or branched alkylene group optionally containing O and/or S; R1 and R2 are each independently H, a 1-6C linear or branched alkyl or alkenyl group or a 6-8C aryl group provided they may combine with each other to form, together with a carbon atom to which they are bonded, a 5-7C cycloalkyl group; and R3 is a 1-10C alkylene. Examples of the heterocyclic compound are the ones having main chains selected from among hydrocarbons, polyethers, or the like, having hydroxyl groups on the side chains.
申请公布号 JP2000303057(A) 申请公布日期 2000.10.31
申请号 JP19990113661 申请日期 1999.04.21
申请人 SANYO CHEM IND LTD 发明人 SAITO HIDEAKI;HONDO FUMIAKI
分类号 C09K3/10;C08G59/40;(IPC1-7):C09K3/10 主分类号 C09K3/10
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