发明名称 Lead-free solder and soldered article
摘要 A lead-free solder contains nickel, silver and tin. A soldered article is a workpiece containing a transition metal conductor capable of readily diffusing into melted tin; and the lead-free solder; wherein the lead-free solder is applied and bonded to the workpiece so as to be electrically and mechanically bonded to the transition metal conductor. The lead-free solder and soldered article barely cause electrode erosion during soldering or during aging after soldering, and have high tensile strength and thermal impact resistance.
申请公布号 US6139979(A) 申请公布日期 2000.10.31
申请号 US19990289449 申请日期 1999.04.09
申请人 MURATA MANUFACTURING CO., LTD. 发明人 TAKAOKA, HIDEKIYO;MAEGAWA, KIYOTAKA
分类号 B23K35/22;B23K35/00;B23K35/26;C22C13/00;C22C13/02;(IPC1-7):B32B15/01 主分类号 B23K35/22
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