发明名称 |
Lead-free solder and soldered article |
摘要 |
A lead-free solder contains nickel, silver and tin. A soldered article is a workpiece containing a transition metal conductor capable of readily diffusing into melted tin; and the lead-free solder; wherein the lead-free solder is applied and bonded to the workpiece so as to be electrically and mechanically bonded to the transition metal conductor. The lead-free solder and soldered article barely cause electrode erosion during soldering or during aging after soldering, and have high tensile strength and thermal impact resistance.
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申请公布号 |
US6139979(A) |
申请公布日期 |
2000.10.31 |
申请号 |
US19990289449 |
申请日期 |
1999.04.09 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
TAKAOKA, HIDEKIYO;MAEGAWA, KIYOTAKA |
分类号 |
B23K35/22;B23K35/00;B23K35/26;C22C13/00;C22C13/02;(IPC1-7):B32B15/01 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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