发明名称 CPU heat sink mounting arrangement
摘要 A CPU heat sink mounting arrangement, which includes a circuit board carrying a CPU at the top side, a heat sink attached to the CPU, a positioning plate attached to the circuit board at the bottom side, the positioning plate having four necked upright mounting rods inserted through respective through holes at the CPU and the heat sink, and two locking plates fastened to the upright mounting rods to lock the heat sink, the circuit board and the positioning plate together, wherein the locking plates each have two upwardly obliquely extended and slotted spring strips for fastening to the necked upright mounting rods.
申请公布号 US6141220(A) 申请公布日期 2000.10.31
申请号 US19990285102 申请日期 1999.04.02
申请人 GLOBAL WIN TECHNOLOGY CO., LTD. 发明人 LIN, SHIH-JEN
分类号 H01L23/40;(IPC1-7):H05K7/20 主分类号 H01L23/40
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