| 发明名称 |
Apparatus and a method for conditioning a semiconductor wafer polishing pad |
| 摘要 |
A semiconductor wafer polishing pad conditioner which includes a support structure and a roller which is rotatably mounted to the support structure. The roller has a working surface which is formed with a plurality of blades.
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| 申请公布号 |
US6139404(A) |
申请公布日期 |
2000.10.31 |
| 申请号 |
US19980009469 |
申请日期 |
1998.01.20 |
| 申请人 |
INTEL CORPORATION |
发明人 |
YAU, LEOPOLDO D. |
| 分类号 |
B24B37/04;B24B53/007;B24B53/14;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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