发明名称 Method for fabricating a cylinder capacitor
摘要 A method for fabricating a cylinder capacitor of a DRAM cell that starts with forming a first oxide layer and then a doped first polysilicon layer on a substrate, patterning the first polysilicon layer to form a first opening that exposes the first oxide layer, forming a polysilicon spacer at the laterals of the first opening. Then, a portion of the first oxide layer is removed to expose the substrate by using the polysilicon spacer and the first polysilicon layer as a mask. A doped second polysilicon layer is formed on the first polysilicon layer and in the first opening. A portion of the second polysilicon layer is removed to form a second opening. A oxide spacer is formed on the laterals of the second opening, and is used as mask to remove a portion of the second polysilicon layer for forming a lower electrode. A dielectric layer and then a third polysilicon layer are formed on the lower electrode after the silicon oxide spacer is removed, wherein the third polysilicon is an upper electrode.
申请公布号 US6140201(A) 申请公布日期 2000.10.31
申请号 US19980172407 申请日期 1998.10.14
申请人 UNITED MICROELECTRONICS CORP. 发明人 JENQ, J. S. JASON;CHIEN, SUN-CHIEH;WU, DER-YUAN;WANG, CHUAN-FU
分类号 H01L21/02;H01L21/314;H01L21/8242;(IPC1-7):H01L21/20 主分类号 H01L21/02
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