| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition giving polymeric materials with low dielectric constant, good heat resistance and adhesion and high film hardness by including a specific polymer, solid particles and a tertiary amino compound. SOLUTION: This composition is obtained by including (A) 100 pts.wt. of a polymer comprising, as constituents, (i) 5-35 mol% of 3-30C tri- or tetravalent crosslinked group and (ii) at least one kind of group selected from those of formula I to IV (Q1, Q3 and Q10 are each a >=2C tri- or tetravalent organic group; Q2, Q6, Q8, Q9, Q11 and Q14 are each a >=2C bivalent organic group; Q4, Q5 and Q12 are each H or a univalent organic group; p, s, u and w are each 1-100; q, r, t, v, x and y are each 1 or 2; Q7, Q13 and Q15 are each a >=2C tri- to hexavalent organic group; Z is O, S or NH), (B) pref. 1-100 pts.wt. of solid particles, and (C) pref. 0.5-100 pts.wt., based on 100 pts.wt. of the component B, of a tertiary amino compound.
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