发明名称 Molding for holding heat sinks in a clamped stack
摘要 In a semiconductor clamped stack, in particular for high-power converters, a plurality of power semiconductor components are arranged alternately together with water-cooled cooling cans in a stack. A clear arrangement of all the components and supplies is achieved, and defective semiconductor components can be replaced more easily, in that a molding (10) according to the invention is used for holding in each case one heat sink and one power semiconductor component. Rails and latching-in fasteners are provided for guiding and holding the latter.
申请公布号 US6140699(A) 申请公布日期 2000.10.31
申请号 US19990345510 申请日期 1999.07.01
申请人 ASEA BROWN BOVERI AG 发明人 HILDBRAND, URS;KELLER, THOMAS;STEMMLER, CHRISTOPH
分类号 H01L23/40;H01L23/473;H01L25/07;(IPC1-7):H01L23/34 主分类号 H01L23/40
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