发明名称 |
Molding for holding heat sinks in a clamped stack |
摘要 |
In a semiconductor clamped stack, in particular for high-power converters, a plurality of power semiconductor components are arranged alternately together with water-cooled cooling cans in a stack. A clear arrangement of all the components and supplies is achieved, and defective semiconductor components can be replaced more easily, in that a molding (10) according to the invention is used for holding in each case one heat sink and one power semiconductor component. Rails and latching-in fasteners are provided for guiding and holding the latter.
|
申请公布号 |
US6140699(A) |
申请公布日期 |
2000.10.31 |
申请号 |
US19990345510 |
申请日期 |
1999.07.01 |
申请人 |
ASEA BROWN BOVERI AG |
发明人 |
HILDBRAND, URS;KELLER, THOMAS;STEMMLER, CHRISTOPH |
分类号 |
H01L23/40;H01L23/473;H01L25/07;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|