发明名称 |
WAFER POLISHING PAD |
摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad with a quick polishing speed capable of imparting a wafer having an excellent thickness uniformity. SOLUTION: The polishing pad is used, in which a rotating wafer is polished by urging a polishing pad to a wafer surface and sliding and rubbing the rotating polishing pad to the wafer surface rotated by rotating a spindle shaft of a wafer chuck mechanism and a spindle shaft of the polishing pad. An abrasive cloth for sliding and rubbing the wafer surface of the polishing pad is a cloth formed to a non woven cloth having a bulk density of 0.075-0.13 g/cm3 in which a fiber having a fiber diameter of 310 μm and a fiber length of 3-20 cm indicates an alumina silicate mineral composition containing 12% by weight or more of a mullite crystal obtained by sintering an organic fiber having 70-80% by weight of alumina arid 30-20% by weight of silicon oxide. |
申请公布号 |
JP2000301449(A) |
申请公布日期 |
2000.10.31 |
申请号 |
JP19990108804 |
申请日期 |
1999.04.16 |
申请人 |
OKAMOTO MACHINE TOOL WORKS LTD |
发明人 |
YAMADA TSUTOMU;KUBO TOMIO |
分类号 |
B24B37/20;B24B37/24;B24D3/00;B24D11/00;H01L21/304 |
主分类号 |
B24B37/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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