发明名称 PACKAGE SEALING DEVICE, AND MANUFACTURE OF SURFACE ACOUSTIC WAVE DEVICE USING IT
摘要 PROBLEM TO BE SOLVED: To provide a package sealing device to prevent the breakage of a package, and a manufacturing method of a surface acoustic wave device using it. SOLUTION: A package sealing device comprises a heater chip 4 to heat a lid 3 to seal an opening part of a package 2, a pulse heat power source 10 to supply the heat to the heater chip 4, a thermocouple 11 to detect the temperature of the heater chip 4, and feed the detected temperature back to the pulse heat power source 10 to control the temperature of the pulse heat power source 10, and a clamp lever 8 to control the position of the heater chip 4, the heater chip 4 comprises a shank portion 4a and a heat generating portion 4b, and implements the sealing process by using the package sealing device whose contact surface to the lid 3 is formed of a metal large in electric resistance and poor in heat conductivity.
申请公布号 JP2000301326(A) 申请公布日期 2000.10.31
申请号 JP19990112048 申请日期 1999.04.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IWATA KAZUO;TANATSUGI EIJI;MATSUO SATOSHI
分类号 B23K1/14;B23K3/03;B23K3/04;B23K3/047;B23K31/02;B23K101/12;B23K101/36;H01L23/02;H03H9/25;(IPC1-7):B23K1/14 主分类号 B23K1/14
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