| 摘要 |
PROBLEM TO BE SOLVED: To securely and efficiently execute plating on desired electrodes by forming electrodes contg. a metallic component to be formed into a catalyst and applying electroless plating on the electrodes. SOLUTION: Ag powder as conductive component, Pd powder to be formed into a catalyst, an organic solvent and a resin are blended and kneaded to prepare conductive paste 1. This conductive paste 1 is applied to a prescribed position on a substrate 2 so as to form into a prescribed electrode pattern. The conductive paste 1 is heat-treated and baked to form plural thick film electrodes 3. If required, the surfaces of the thick film electrodes 3 are degreased or subjected to etching for improving their adhesion with plating films. Then, the substrate 2 is dipped into an electroless plating bath contg. Ni as plating metal to form Ni plating films 4 on he surfaces of the thick film electrodes 3. Moreover, this substrate 2 is dipped into an electroless plating bath contg. Au as plating metal, and Au plating films 5 are formed on the Ni plating films 4 formed on the surfaces of the thick film electrodes 3.
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