发明名称 INNER CIRCUMFERENTIAL CUTTER BLADE AND CUT-OFF DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent an inner circumferential cutter blade from bending by receiving cutting resistance during cutting by providing abrasive grain layers formed by fixedly fitting abrasive grains on both sides of a hollow base plate. SOLUTION: On the inner circumferential part of a base plate 15 provided with a hollow part 13 on the center part, a chip part 17 fixedly fitted together abrasive grains (cutting abrasive grains) is provided. Abrasive grain layers 18 fixedly fitting together abrasive grains (cutting abrasive grains) by metal bond, resin bond, electrocoating, or the like are provided on the sides 15a of the base plate 15. When cutting resistance is received during cutting to bend, an inner circumferential cutter blade 11 is bent, and it is contacted with an object to be cut off, the contact part is ground by the abrasive grain layer 18, and hence contact resistance can be remarkably reduced. The inner circumferential cutter blade 11 is coated with the abrasive layer 18, the strength is increased, the inner circumferential cutter blade 11 is not bent during cutting, therefore the cutting face is not bent. The side height of the abrasive grain layer 18 is lower than the side height of the chip part 17.
申请公布号 JP2000301463(A) 申请公布日期 2000.10.31
申请号 JP20000027853 申请日期 2000.02.04
申请人 ATOKKU:KK;SHINETSU QUARTZ PROD CO LTD 发明人 MIZUNO TORU;HATTORI IKUO;SUGAMA AKIHIKO
分类号 B24D5/12;(IPC1-7):B24D5/12 主分类号 B24D5/12
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