| 摘要 |
A microelectronic component handling system and an apparatus for manipulating microelectronic components in manufacturing assembly processes. In one embodiment, a microelectronic component handling system may have a base or a support member, a track or platform attached to the base to rotate about a rotational axis, and a linear drive assembly to rotate the track about the rotational axis. The track may have a first end, a second end spaced apart from the first end along a longitudinal axis of the track, a top surface facing away from the base, and a bottom surface facing toward the base. Additionally, the linear drive assembly may have an actuator and a rod driven by the actuator along a displacement axis spaced apart from the rotational axis. In operation, the actuator moves the rod along the displacement axis to rotate the track about the rotational axis to a raised position at an inclination sufficient to slide a microelectronic component down the track. In one particular application of a handling system in accordance with the invention, the handling system is a constituent part of a lead configuring device having a first die with a first blade set and a second die with a second blade set. In another particular application, the handling system is a constituent part of a microelectronic component assembly line in which the track is positioned between first and second assembly line sections.
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