发明名称 PALLADIUM ALLOY PLATING SOLUTION, PALLADIUM-COPPER ALLOY PLATED MEMBER AND ANTIBACTERIAL MEMBER
摘要 PROBLEM TO BE SOLVED: To obtain a plating layer with a beautiful white lustrous face which does not contain components causing allergic reaction and is low in inside stress even in the case thick plating is executed by allowing a plating soln. to contain a soluble Pd salt, a soluble Cu salt, an electrically conductive compd., a pyridine ring-contg. compd. and a soluble semimetal compd. of specified concns. SOLUTION: This plating soln. contains a soluble Pd salt of 1 to 50 g/l expressed in terms of Pd, a soluble Cu salt of 0.01 to 50 g/l expressed in terms of Cu, an electrically conductive compd. of 50 to 500 g/l, a pyridine ring-contg. compd. of 0.01 to 40 g/l and a soluble semimetal compd. of 0.001 to 2 g/l expressed in terms of semimetal. As the concrete constituting example of the plating soln., the combination of tetraamminepalladium chloride as the soluble Pd salt, copper sulfate as the soluble Cu salt, calcium pyrophosphate as the electrically conductive compd., pyridine-3-sulfonic acid as the pyridine ring-contg. compd. and selenous acid as the soluble semimetal compd. is preferably listed.
申请公布号 JP2000303199(A) 申请公布日期 2000.10.31
申请号 JP19990153650 申请日期 1999.06.01
申请人 NISSHIN KASEI KK 发明人 MURAKAMI HIROMICHI;KIKUCHI HIDEO;YAMAGUCHI YOSHINORI;HAYASHI YASUHIRO
分类号 C25D3/50;C25D1/00;C25D3/56;(IPC1-7):C25D3/50 主分类号 C25D3/50
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