发明名称 Cooling apparatus for electronic systems and computer systems with such apparatus
摘要 Cooling apparatus for electronic systems and a computer system with such apparatus is disclosed. The apparatus dissipates heat from circuit boards of such systems to the surroundings, thus effectively cooling the circuit boards. The cooling apparatus has a cooling unit, having a board seat defined in its bottom and side walls and seating a circuit board in the seat. A fan is exteriorly seated on the unit at a position opposite to the board seat. An air passage extends from the fan to the board seat, thus dissipating heat from the circuit board to the surroundings using air. Such a cooling unit is detachably set in the main body of a computer system with both a central processing board being seated in the board seat of the unit and a system board being set in the main body.
申请公布号 US6141214(A) 申请公布日期 2000.10.31
申请号 US19980164345 申请日期 1998.10.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN, TAE-BONG
分类号 G06F1/20;H05K7/20;(IPC1-7):H05K7/20;F28D11/00;F28F7/00 主分类号 G06F1/20
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