发明名称 |
Cooling apparatus for electronic systems and computer systems with such apparatus |
摘要 |
Cooling apparatus for electronic systems and a computer system with such apparatus is disclosed. The apparatus dissipates heat from circuit boards of such systems to the surroundings, thus effectively cooling the circuit boards. The cooling apparatus has a cooling unit, having a board seat defined in its bottom and side walls and seating a circuit board in the seat. A fan is exteriorly seated on the unit at a position opposite to the board seat. An air passage extends from the fan to the board seat, thus dissipating heat from the circuit board to the surroundings using air. Such a cooling unit is detachably set in the main body of a computer system with both a central processing board being seated in the board seat of the unit and a system board being set in the main body.
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申请公布号 |
US6141214(A) |
申请公布日期 |
2000.10.31 |
申请号 |
US19980164345 |
申请日期 |
1998.10.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
AHN, TAE-BONG |
分类号 |
G06F1/20;H05K7/20;(IPC1-7):H05K7/20;F28D11/00;F28F7/00 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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