发明名称 |
METHOD AND DEVICE FOR FLATTENING MACHINING |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for flattening a machined face by removing an unnecessary thin film from the machined face when a workpiece is a substrate in which a thin film is formed on a surface which is the machined face and parts having different machining rates exist and whose thickness of thin film is not uniform. SOLUTION: When a substrate 2 which has a groove part 2a on a surface which is a machined face 1a and on which a thin film 3 is formed is a workpiece 1, a polishing pad 8 having smaller polishing face than the machined face 1a is rotated by itself by pressing it against the machined face 1a to polish by moving the polishing pad 8 relatively for the machined face 1a for polishing. At this time, when the polishing pad 8 is pressed against the machined face 1a, a pressure applied on the machined face 1a is changed by polishing parts 4a, 4b to uniformize machining rates at each position and flatten the machined face 1a uniformly.
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申请公布号 |
JP2000301438(A) |
申请公布日期 |
2000.10.31 |
申请号 |
JP19990112326 |
申请日期 |
1999.04.20 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TAKAHATA KENICHI;OTSUKA KYO |
分类号 |
B24B7/04;B24B1/00;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B24B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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