| 摘要 |
<p>A semiconductor laser module capable of restricting a decrease in a coupling efficiency of a laser beam with respect to an optical fiber even if a mounting surface of a semiconductor laser element is warped in a temperature control element. A semiconductor laser module (1), wherein a heat radiating member (5) and an optical coupling means (7a) are directly or indirectly mounted on the mounting surface (3a) of a temperature control element (3), and a semiconductor laser element (6) and the optical coupling means (7a) are disposed on the same side in a laser beam emission direction with respect to a first center line (Lcpp) perpendicularly crossing a tangential plane at the center of the mounting surface (3a) of the temperature control element (3) and/or a second center line passing through the center of the mounting surface of the temperature control element and being respectively perpendicular to the first center line and to an axis representing an emission direction of a laser beam from the semiconductor laser element.</p> |
