METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING LINE THEREOF

摘要

A manufacturing line of a semiconductor in which a semiconductor wafer having a diameter of 6 inches (150 +/- 3mm : SEAJ standards) is used and the wafer is subjected to a series of processings to form an integrated circuit on the wafer. The manufacturing line comprises two sub-lines having the same specifications. Each sub-line is constituted by a series of processing apparatuses including a film-forming device, a pattern aligner, an etching device and a test device. At least an aligner and an etching device can perform microlithographic patterning of 0.3 mu m or less. A semiconductor device manufacturing method including means for transferring a semiconductor wafer under processing between the two sub-lines and capable of handling a plurality of wafer sizes, and its manufacturing line are provided.