| 摘要 |
<p>A heat sink base, a heat sink which can be manufactured easily at low cost and can efficiently dissipate heat generated from a semiconductor, and a method of manufacturing the heat sink. A heat sink (10) inegrally has a recessed and protruded surface corresponding to the shape of a semiconductor device on the side of a heat sink base (11) where the semiconductor device is mounted. The heat sink is manufactured by forming a recessed part (26) in the surface of a base plate (24) to be a template, forming a heat sink base material layer (27) on the surface of the base plate (24), removing the base plate (24) from the heat sink base material layer (27) to form a heat sink base (11) having a protruded part (23) to the surface of which the recessed part (26) is transferred, forming metalized layers (15 and 16), in multilayer, comprising a metal film (17), a protective layer (18) and an electrode layer (19) on the side surface having at least the protruded part (23) on the heat sink base (11) where the semiconductor device is mounted, and forming adhesive layers (13 and 14) for adhering a semiconductor device (12) in multilayer on the recessed part (23) of the heat sink base (11).</p> |
