| 摘要 |
<p>The invention relates to an integrated circuit device (1) comprising an active layer (2) made of a semiconductor material; an integrated circuit having one active surface (4) of said active layer (2), whereby the integrated circuit has circuit elements and at least one contact (5) flush with said active surface (4); an additional layer (3) fixed to the active surface (4), whereby said additional layer (3) at least partially covers the integrated surface of the active layer (2). The invention is characterized in that a hole (20, 23) is made in the additional layer (3), whereby said hole (20, 23) is perpendicular to at least one circuit element. The invention is especially suitable for use with chip cards.</p> |
