| 摘要 |
Two contact surfaces (9,10) are produced on rear side of the inner layer (1) which has transponder coil (3) printed on other side. Inner layer of card is 80 to 200 micrometers thick and is made of white opaque plastic foil. Preferably layer is 100 micrometer thick and through hole for through connection is 50 to 200 micrometer diameter. Chip card has transponder coil (3) printed on carrier material (1) to directly contact IC element (8) without carrier housing. Coil is printed on one side of carrier material and two contact surfaces (9,10) for IC contact surfaces (6,7) are printed on other side using electrically conductive polymer paste. Each end of transponder coil overlaps with at least one contact surface (9,10) and are connected electrically to coil ends by small through connections (4,5) on carrier material. Independent claim included for manufacture process for contactless chip card
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