| 摘要 |
A method, and apparatus are provided for processing solid material in general, and dental material (12) in particular, which involves applying radiation from a pulsed laser (7) to ablate the material (12). Particles of ablation (13, 14) are generated by the radiation (1) form the area of processing, and/or other sources which are reflected by reflector (10) to the area of processing to further ablate the material (12). Ablation particles (13, 14) may also be obtained form the ablation of the tip (9), form a strip of material (25) through which radiation passes before reaching the region of processing or from other sources. A mechanism (17, 18) may also be provided for cooling the surface of the material in the region of processing between radiation pulses, during such pulses for facilitating removal of particles in the area between the chip, and the region of processing between radiation pulses.
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