SOCKET FOR ELECTRICAL TESTING BALL GRID ARRAY PACKAGE AND METHOD THEREOF

摘要

PURPOSE: A socket for electrical testing a ball grid array(BGA) package is to prevent a solder ball from being damaged by interconnecting an external connecting terminal of the BGA package and a tester. CONSTITUTION: A socket for electrical testing a BGA package comprises a flat socket board(116) having a number of pins(118) to be connected to a tester channel in a one by one, an intermediate connecting portion consisting of a pressure conductive rubber contacted with the pins of the socket board, a mesh(121) of insulation material, positioned on the intermediate connection portion, for determining a laying position of an external connecting terminal, and an alignment member(122), provided the intermediate connection portion and an edge of the mesh, for fixing and supporting the portion and the mesh. The socket further comprises a contact for contacting the external terminal with the intermediate portion through the mesh.