Bond pad option for integrated circuits

摘要

An integrated circuit (10) having a first and second bond pads (41, 43), a latch circuit (50), and a voltage lead (31). Different configurations of the internal circuitry (20) of the integrated circuit (10) are selected by applying the voltage lead (31) either to the first or second bond pads (41, 43). This result is achieved because the latch circuit (50), coupled between the first and second bond pads (41, 43), is capable of inverting the voltage response seen at the first bond pad.