| 摘要 |
PURPOSE: A land grid array and a method of manufacturing the same are to manufacture using single process, thereby increasing its reliability. CONSTITUTION: A land grid array comprises a lead frame(11), an inner lead(13) arranged on an outside of a paddle of the lead frame, and a semiconductor chip(15) adhered to an upper surface of the paddle of the lead frame by a glue(14). A chip pad formed on an upper surface of the chip and the inner lead are connected to a metal wire(16), respectively. A land(17) having a groove is fixed to a lower surface of the inner lead The land is patterned on an upper surface of a tape(20). An epoxy body(18) is formed on the surface of the tape by molding with epoxy, so that the chip, paddle, and the inner lead are covered. A package is manufactured by peeling off the tape adhered to a lower surface of the epoxy body. |
