| 摘要 |
PROBLEM TO BE SOLVED: To greatly reduce the cost without ball-like solder bumps. SOLUTION: This semiconductor structural body is provided with a through- hole 2 in a semiconductor board 1 made of silicon, etc., and it is also provided with an intermediate insulating layer 4, which is formed in contact directly with the surface of the inner circumference of the through-hole 2 and a conductor layer 5 which is laminated and formed thereinside, and a via hole 3 is formed in a manner such that its one end is projected from one main surface of the semiconductor board 1. Then, the side circumferential surface of the projecting part of the via hole is covered with the intermediate insulation layer 4, extending from the through-hole 2. A semiconductor chip is mounted to such the structural body, and its electrode terminal is connected with the conductor layer 5 of the via hole 3, thereby obtaining a semiconductor device having a high connection reliability. |
