| 摘要 |
PROBLEM TO BE SOLVED: To significantly reduce the inductance of the connection part of a superconducting integrated circuit chip with a circuit board by using bumps of a height of several microns and to modify the high-speed signal transmission characteristics of a superconducting integrated circuit. SOLUTION: This flip-chip connection method is performed by a method wherein a plurality of bumps 12, which consist of a Pb/In alloy and have a height of several microns, are arranged on an Nb wiring 11 on a substrate, which is a superconducting integrated circuit chip, a plurality of bumps 12, which consist of a Pb/In alloy and have a height of several microns, are arranged on an Nb wiring 11 on a substrate, which is a circuit board which is used as a multichip module, the chip is held on the circuit board in such a way that the chip is made to oppose to the circuit board and after the positions of both are made to accurately align with each other, the chip and the circuit board are brought into contact with each other and are heated for a constant time and the chip is pressed to the circuit board to form a bonding of the chip to the circuit board. |
