发明名称 Ceramic substrate having a sealed layer
摘要 Disclosed is a multilayer ceramic substrate, and a method for forming same, which has an outer unsealed layer having a metallic via, an inner sealed layer having a composite via of metallic and ceramic materials and a further unsealed layer having a metallic via.
申请公布号 US6136419(A) 申请公布日期 2000.10.24
申请号 US19990320532 申请日期 1999.05.26
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 FASANO, BENJAMIN V.;INDYK, RICHARD F.;KAMATH, SUNDAR M.;KNICKERBOCKER, JOHN U.;LANGENTHAL, SCOTT I.;O'CONNOR, DANIEL P.;REDDY, SRINIVASA S. N.
分类号 H05K1/11;B32B18/00;H01L23/12;H01L23/498;H05K1/03;H05K3/24;H05K3/40;H05K3/46;(IPC1-7):B32B3/00 主分类号 H05K1/11
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