发明名称 LASER PROCESSING SYSTEM AND LASER PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To enhance crystallinity of a silicon film formed through irradiation with laser light by crystallizing an amorphous silicon film subjected to heat treatment and keeping a sample within a specified temperature width of heat treatment temperature during irradiation with laser beam thereby attaining a constant effect at all times in laser annealing technology. SOLUTION: A large number of substrates formed with a silicon film to be irradiated with laser beam or a thin film transistor in the way of fabrication and contained in a cassette are moved, along with the cassette, to a receiving/ delivering chamber 101. A delivery chamber 102 is provided with a robot arm 106 incorporating a heating means contrived to keep the substrate at a constant temperature even during carriage. The substrates are carried, sheet by sheet, between the delivery chamber 102 and a laser irradiation chamber 103 and between the delivery chamber 102 and a heating chamber 104 for containing a large number of substrates. After heat treatment, heating temperature is preferably in the range of 550-600 deg.C during irradiation with laser beam and heating is carried out preferably in the range of 550±100 deg.C.
申请公布号 JP2000299292(A) 申请公布日期 2000.10.24
申请号 JP20000059318 申请日期 2000.03.03
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 TERAMOTO SATOSHI;HAMAYA TOSHIJI
分类号 C23C14/58;C23C16/56;H01L21/20;H01L21/265;H01L21/268;H01L21/677;H01L21/68;(IPC1-7):H01L21/268 主分类号 C23C14/58
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