发明名称 METALLIC HEAT SINK FOR SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To simplify the manufacturing process of a heat sink having the functions of a heat spreader and a stiffener by forming stiffener sections by bending and doubling the sections protruded from a heat sink section formed in a regular octagonal shape. SOLUTION: A heat sink section 2 is formed in a square plate-like state, and stiffener sections 3 are formed by downwardly doubling four sides of the section 2 180 deg. until the sections 3 are put on the lower surface of the peripheral section of heat sink section 2. Consequently, a semiconductor chip mounting section 4 which is formed at the center of the heat sink section 2 is surrounded by the stiffener sections 3. Then a double coated adhesive tape 5 is stuck to the stiffener section 3 for sticking the sections 3 to a substrate composed of a polyimide tape. Therefore, the manufacturing process of the metallic heat sink 2 can be simplified, because it becomes unnecessary to form the stiffener sections 3 by using different metallic sheets from that of the heat sink section 2, and no taping work is required for fixing the sections 3 to the section 2.
申请公布号 JP2000299417(A) 申请公布日期 2000.10.24
申请号 JP19990109490 申请日期 1999.04.16
申请人 NICHIDEN SEIMITSU KOGYO KK 发明人 ISHIHARA TAKAO
分类号 H01L23/36;(IPC1-7):H01L23/36 主分类号 H01L23/36
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