| 摘要 |
PROBLEM TO BE SOLVED: To form desirable wafer cut surfaces efficiently at low machining cost via cutting by fixed abrasive grain multi-wire saws. SOLUTION: In cutting, a fixed abrasive grain multi-wire saw 10 sprays water or water-soluble machining fluid 50 over cut portions of an ingot 38 and thereabout. The machining fluid 50 can thus be easily batch-controlled, so that the construction of the fixed abrasive grain multi-wire saw 10 is simplified accordingly. An improvement in cooling effect can maintain desirable precision in the cut surfaces and also a desirable working environment, and can facilitate the handling of the machining fluid 50. The wire saw 10 is thus highly productive despite of low cost. |
