| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition for forming a film, from which a uniform coating film having superior dielectric constant characteristic, heat resistance, mechanical characteristic, etc., can be formed and a film which is formed by hardening the composition. SOLUTION: A composition for forming a film contains (A) the hydrolysate of a compound represented by R1nSi(OR2)4-n (where R1 and R2 represent identical or different elements, having univalent organic groups, and (n) represents integer of 0 to 2) and its partial condensate or either the hydrolysate or partial condensate, (B) an alkylene glycol-based solvent, (C) at least one kind of solvent selected from among an ester-based solvent and a ketone-based solvent, and (D) a compound which is made compatible with or is dispersed in the component (A) and has a boiling point or a decomposition temperature of 250-450 deg.C.
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