发明名称 |
Mobile charge immune process |
摘要 |
A semi conductor manufacturing process including uniform negative polarity wafer charging to remove or immobilize alkali ions such that the device becomes immune to their presence. The wafer is charged with a corona discharge at a 1MV/cm-2MV/cm bias field and low temperature (200 DEG C.-300 DEG C.) heating to bring mobile ions to the wafer's surface. Surface mobile ions are removed with a deionized (DI) water rinse or a standard sequential wafer wet cleaning step, immobilized with a normal gate (polysilicon) or metal contact formation step or both, thereby effectively removing mobile ions from the semiconductor structure.
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申请公布号 |
US6136669(A) |
申请公布日期 |
2000.10.24 |
申请号 |
US19980120213 |
申请日期 |
1998.07.21 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FLITSCH, FREDERICK ALBERT;FUNG, MIN-SU |
分类号 |
H01L21/28;H01L21/322;H01L21/326;(IPC1-7):H01L21/326 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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