发明名称 Mobile charge immune process
摘要 A semi conductor manufacturing process including uniform negative polarity wafer charging to remove or immobilize alkali ions such that the device becomes immune to their presence. The wafer is charged with a corona discharge at a 1MV/cm-2MV/cm bias field and low temperature (200 DEG C.-300 DEG C.) heating to bring mobile ions to the wafer's surface. Surface mobile ions are removed with a deionized (DI) water rinse or a standard sequential wafer wet cleaning step, immobilized with a normal gate (polysilicon) or metal contact formation step or both, thereby effectively removing mobile ions from the semiconductor structure.
申请公布号 US6136669(A) 申请公布日期 2000.10.24
申请号 US19980120213 申请日期 1998.07.21
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 FLITSCH, FREDERICK ALBERT;FUNG, MIN-SU
分类号 H01L21/28;H01L21/322;H01L21/326;(IPC1-7):H01L21/326 主分类号 H01L21/28
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