发明名称 Method and apparatus for producing an electrical bond between conductors and electrical connector contacts
摘要 A method and apparatus for producing an electrical bond between a conductor and an electrical connector contact. The apparatus generally comprises a power source and a weld head. The power source has a first polarity output and a second polarity output. The weld head has an input for connection to the first polarity output of the power source. The apparatus includes a first electrode electrically connected to the weld head input. The apparatus further includes a second electrode electrically connected to the second polarity output of the power source. The method comprises the steps of positioning the conductor and the connector contact so that the conductor and connector contact are in physical contact with one another and positioned over the second electrode, contacting the conductor and the connector contact with the first electrode with a predetermined compressive force so that the conductor and connector contact are pressed against each other and against the second electrode, and allowing a current of a predetermined magnitude to flow through the first electrode, the conductor and connector contact, and the second electrode.
申请公布号 US6137075(A) 申请公布日期 2000.10.24
申请号 US19980187151 申请日期 1998.11.06
申请人 C&M TECHNOLOGIES GROUP, INC. 发明人 GRABOWSKI, THADDEUS;TKAZYIK, WILLIAM J.;TOLLA, ANTHONY;STERC, GREGORY
分类号 H01R43/02;(IPC1-7):B23K11/00;B23K11/10 主分类号 H01R43/02
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