SOLDERING DEVICE WITH FILM SEPARATING FUNCTION

摘要

PROBLEM TO BE SOLVED: To provide a soldering device which has a film separating function and capable of using a covered lead wire coated with a high-heat resistant insulating film. SOLUTION: This soldering device is composed of a laser mechanism 1, which generates a laser beam 2 which damages the insulating film of a covered lead wire 11 and peels it off from the lead wire 11, a chuck 6 which is capable of pivoting freely around an operating point 10 and moving freely holding a work 3, and a solder both 7, where connection terminals wounded with the covered lead wire 11 from which an insulating film is separated are dipped and soldered.